IP Library Assignment 013667/0095
Patent Assignment
Reel/Frame 013667/0095

Assignment of Assignor's Interest

Recorded: 2003-01-16 Pages: 3
Assignors
GANOT, AMNON
Executed: 2002-12-25
GINO, HANAN
Executed: 2002-12-24
HANINA, GOLAN
Executed: 2002-12-24
KANTOR, ZEEV
Executed: 2003-01-05
KLING, BORIS
Executed: 2002-12-25
SPINZI, SHABTAY
Executed: 2002-12-29
BEN-EZRA, BARRY
Executed: 2002-12-29
Assignee
ORBOTECH LTD.
P.O. BOX 215, YAVNE, 81102, ISRAEL
Covered Property (1)
Multi-Layer Printed Circuit Board Fabrication System and Method
Patent: 7,058,474 →
Application: 10/265,074 →
Publication: US 2003/0086600
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Mar 7, 2016
From: ORBOTECH LTD.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 038021/0001 →
Release of Security Interest Jul 5, 2016
From: JPMORGAN CHASE BANK, N.A.
To: ORBOTECH LIMITED
Reel/Frame 039256/0711 →