Patent Assignment
Reel/Frame 013688/0315
Assignment of Assignor's Interest
Recorded: 2003-01-22
Pages: 3
Assignors
ENQUIST, PAUL M.
Executed: 2003-01-20
TONG, QIN-YI
Executed: 2003-01-20
FOUNTAIN, GAIUS GILLMAN JR.
Executed: 2003-01-20
MARKUNAS, ROBERT
Executed: 2003-01-20
Assignee
ZIPTRONIX
3040 CORNWALLIS ROAD, P.O. BOX 12194, RESEARCH TRIANGLE PARK, NORTH CAROLINA, 27709
Covered Property
(1)
Wafer Bonding Hermetic Encapsulation
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Change of Name
Jun 28, 2017
From: ZIPTRONIX , INC.
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 043029/0657 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →