IP Library › Assignment 013708/0582
Patent Assignment
Reel/Frame 013708/0582

Assignment of Assignor's Interest

Recorded: 2003-01-28 Pages: 3
Assignors
KOUMA, NORINAO
Executed: 2002-12-16
MIZUNO, YOSHIHIRO
Executed: 2002-12-23
OKUDA, HISAO
Executed: 2002-12-16
SAWAKI, IPPEI
Executed: 2002-12-16
TSUBOI, OSAMU
Executed: 2002-12-16
NAKAMURA, YOSHITAKA
Executed: 2002-12-25
Assignees
FUJITSU LIMITED
1-1, KAMIKODANAKA, 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
FUJITSU MEDIA DEVICES LIMITED
460 OAZA KOYAMA, SUZAKA-SHI, NAGANO 382-8501, JAPAN
Covered Property (1)
Method of Making Device Chips Collectively from Common Material Substrate
Patent: 6,881,649 →
Application: 10/352,001 →
Publication: US 2004/0014300
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment Transfer Dec 1, 2006
From: FUJITSU MEDIA DEVICES LIMITED; FUJITSU LIMITED
To: FUJITSU LIMITED
Reel/Frame 018654/0306 →
Assignment of Assignor's Interest Mar 30, 2016
From: FUJITSU LIMITED
To: DRNC HOLDINGS, INC.
Reel/Frame 038139/0578 →