Method of making device chips collectively from common material substrate
View Patent ↗A plurality of micromirror chips are collectively made from a common substrate. Each of the micromirror chips is formed with a micromirror unit including a frame, a mirror-forming portion separate from the frame via spaces, and torsion bars connecting the mirror-forming portion to the frame. The common substrate is subjected to etching to provide the spaces and make division grooves for dividing the common substrate into the individual micromirror chips. The etching for the spaces and the etching for the division grooves are performed in parallel with each other.
1. A method of making a plurality of micromirror chips collectively from a common substrate, each of the micromirror chips including a micromirror unit that includes a frame, a mirror-forming portion separate from the frame via spaces, and a torsion bar connecting the mirror-forming portion to the frame, the method comprising: etching the common substrate to form said spaces; and etching the common substrate to form division grooves for dividing the common substrate into said plurality of micromirror chips,
wherein the etching for formation of said spaces is performed in parallel with the etching for formation of the division grooves.
2. The method according to claim 1 , wherein a reinforcing part connecting corners of micromirror chips is formed during the etching for formation of the division grooves, the reinforcing part being produced by leaving part of the common substrate unetched.
3. The method according to claim 2 , wherein the reinforcing part is formed in parallel with the torsion bar.
4. The method according to claim 1 , wherein the division grooves comprise a first groove and a second groove terminating at a point on the first groove.
5. The method according to claim 1 , wherein the division grooves comprise closed loops separate from each other, each of the closed loops enclosing a corresponding one of the micromirror chips.
6. The method according to claim 5 , wherein each of the closed loops extends to be rectangular or circular.
7. The method according to claim 1 , wherein the common substrate comprises a composite plate including a first electroconductive layer, a second electroconductive layer and an intermediate insulating layer sandwiched by these electroconductive layers, and wherein the division grooves and said spaces are formed in both the first and the second electroconductive layers.
8. The method according to claim 7 , wherein the division groove formed in the first electroconductive layer is offset from the division groove formed in the second electroconductive layer.
9. The method according to claim 1 , wherein the division grooves extend to slant relative to a crystal axis of the common substrate.
10. A method of making a plurality of device chips collectively from a common substrate, the method comprising: etching performed in a structure building process of the device chips; etching performed to form division grooves for dividing the common substrate into individual device chips; and forming a reinforcing part in the division grooves for connecting corners of the device chips;
wherein the etching in the structure building process of the device chips is performed in parallel with the etching to form the division grooves, and wherein the reinforcing part is formed by leaving part of the common substrate unetched.