IP Library › Assignment 013756/0021
Patent Assignment
Reel/Frame 013756/0021

Change of Name

Recorded: 2003-02-19 Pages: 3
Assignor
INTERCON TOOLS, INC.
Executed: 2000-03-31
Assignee
INTERCON TECHNOLOGY, INC.
18255 SUTTER BOULEVARD, MORGAN HILL, CALIFORNIA, 95037
Covered Property (1)
Techniques for Dicing Substrates During Integrated Circuit Fabrication
Patent: 6,688,300 →
Application: 09/956,538 →
Publication: US 2002/0083938
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 16, 2005
From: INTERCON TECHNOLOGY INC.
To: TOWA INTERCON TECHNOLOGY, INC.
Reel/Frame 016216/0372 →
Assignment of Assignor's Interest Dec 18, 2007
From: TOWA INTERCON TECHNOLOGY, INC.
To: TOWA CORPORATION
Reel/Frame 020261/0176 →