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App. No. 09/956,538 · Confirmation No. 3179

TECHNIQUES FOR DICING SUBSTRATES DURING INTEGRATED CIRCUIT FABRICATION

Inventor: Alois Tieber
Patent Expired Due to NonPayment of Maintenance Fees Under 37 CFR 1.362 View Patent ↗ View Publication ↗
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 Code Description Pages PDF
2008-10-01 C.AD Change of Address 1 View
2008-10-01 N417 Electronic Filing System Acknowledgment Receipt 2 View
2003-11-24 IFEE Issue Fee Payment (PTO-85B) 1 View
2003-11-24 LET. Miscellaneous Incoming Letter 1 View
2003-11-24 DRW Drawings-only black and white line drawings 14 View
2002-03-11 TRNA Transmittal of New Application 3 View
2002-03-11 DRW Drawings-only black and white line drawings 14 View
2002-03-11 OATH Oath or Declaration filed 4 View
2001-09-18 TRNA Transmittal of New Application 3 View
2001-09-18 SPEC Specification 32 View
2001-09-18 CLM Claims 11 View
2001-09-18 ABST Abstract 1 View
2001-09-18 DRW Drawings-only black and white line drawings 15 View
2001-09-18 OATH Oath or Declaration filed 2 View
2001-09-18 LET. Miscellaneous Incoming Letter 1 View
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Quick Facts
App. No.
09/956,538
Filed
2001-09-18
Granted
2004-02-10
Pub. No.
US20020083938A1
Art Unit
3723
PTA
-135 days