IP Library › Assignment 013904/0023
Patent Assignment
Reel/Frame 013904/0023

Assignment of Assignor's Interest

Recorded: 2003-08-15 Pages: 2
Assignor
TAN, SAY LEONG
Executed: 2002-12-17
Assignee
AGILENT TECHNOLOGIES, INC.
P.O. BOX 7599, LEGAL DEPARTMENT, DL429, INTELLECTUAL PROPERTY ADMINISTRATION, LOVELAND, COLORADO, 80537-0599
Covered Property (1)
Semiconductor Chip Package with a Package Substrate and a Lid Cover
Patent: 7,400,036 →
Application: 10/320,905 →
Publication: US 2004/0113251
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Document Re-Recorded to Correct an Error Contained in Property Number 10/302,905. Document Previously Recorded on Reel 013430, Frame 0117. Apr 28, 2003
From: TAN, SAY LEONG
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 013997/0566 →
Assignment of Assignor's Interest Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
Assignment of Assignor's Interest May 20, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: III HOLDINGS 1, LLC
Reel/Frame 032932/0719 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment. May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →