Patent Assignment
Reel/Frame 013997/0566
Document Re-Recorded to Correct an Error Contained in Property Number 10/302,905. Document Previously Recorded on Reel 013430, Frame 0117.
Recorded: 2003-04-28
Pages: 3
Assignor
TAN, SAY LEONG
Executed: 2002-12-17
Assignee
AGILENT TECHNOLOGIES, INC.
INTELLECTUAL PROPERTY ADMNINISTRATION, LEGAL DEPARTMENT, DL429, P.O. BOX 7599, LOVELAND, COLORADO, 80537-0599
Covered Property
(1)
Semiconductor Chip Package with a Package Substrate and a Lid Cover
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 15, 2003
From: TAN, SAY LEONG
To: AGILENT TECHNOLOGIES, INC.
Reel/Frame 013904/0023 →
Assignment of Assignor's Interest
Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017206/0666 →
Assignment of Assignor's Interest
May 20, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: III HOLDINGS 1, LLC
Reel/Frame 032932/0719 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 017206 Frame: 0666. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038632/0662 →