Patent Assignment
Reel/Frame 013956/0817
Assignment of Assignor's Interest
Recorded: 2003-04-04
Pages: 4
Assignors
TAKEWAKA, HIROKI
Executed: 2003-03-18
YAMASHITA, TAKASHI
Executed: 2003-03-18
MASAMITSU, TAKESHI
Executed: 2003-03-18
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, TOKYO, 100-8310, JAPAN
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
4-1, MIZUHARA, ITAMI-SHI, HYOGO, 664-0005, JAPAN
Covered Property
(1)
Method of manufacturing interconnection structure applied to semiconductor device
Application:
10/406,184 →
Publication:
US 2004/0087137
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.