Patent Assignment
Reel/Frame 013966/0536
Assignment of Assignor's Interest
Recorded: 2003-04-09
Pages: 7
Assignors
HALAHAN, PATRICK B.
Executed: 2003-04-07
KAO, SAM
Executed: 2003-04-07
LAN, BOSCO
Executed: 2003-04-07
SAVASTIOUK, SERGEY
Executed: 2003-04-07
SINIAGUINE, OLEG
Executed: 2003-04-07
Assignee
TRU-SI TECHNOLOGIES, INC.
657 N. PASTORIA AVENUE, SUNNYVALE, CALIFORNIA
Covered Property
(1)
Electroplating and Electroless Plating of Conductive Materials into Openings, and Structures Obtained Thereby
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 10, 2011
From: TRU-SI TECHNOLOGIES, INC.
To: ALLVIA, INC.
Reel/Frame 025932/0615 →
Assignment of Assignor's Interest
Mar 13, 2012
From: ALLVIA, INC.
To: INVENSAS CORPORATION
Reel/Frame 027853/0420 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →