IP Library › Assignment 013969/0127
Patent Assignment
Reel/Frame 013969/0127

Assignment of Assignor's Interest

Recorded: 2003-04-11 Pages: 3
Assignor
TATSUMI, TAKASHI
Executed: 2003-03-10
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3 MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property (1)
System-In-Package Type Semiconductor Device
Patent: 6,925,018 →
Application: 10/411,271 →
Publication: US 2004/0085796
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name Sep 15, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024990/0129 →
Merger Sep 15, 2010
From: RENESAS TECHNOLOGY CORP.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024990/0153 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →