Patent Assignment
Reel/Frame 013973/0681
Assignment of Assignor's Interest
Recorded: 2003-04-18
Pages: 3
Assignors
MEYER, HEINRICH
Executed: 2003-03-17
CRAMER, KONRAD
Executed: 2003-03-17
KURTZ, OLAF
Executed: 2003-03-17
HERBER, RALPH
Executed: 2003-03-17
FRIZ, WOLFGANG
Executed: 2003-03-17
SCHWIEKENDICK, CARSTEN
Executed: 2003-03-17
RINGTUNATUS, OLIVER
Executed: 2003-03-17
MADRY, CHRISITIAN
Executed: 2003-03-17
Assignee
ATOTECH DEUTSCHLAND GMBH
ERASMUSSTRASSE 20, BERLIN, 10553, GERMANY
Covered Property
(1)
Method of Connecting Module Layers Suitable for the Production of Microstructure Modules and a Microstructure Module
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 1, 2017
From: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA INC
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 041590/0001 →
Release of Security Interest
Mar 18, 2021
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ATOTECH DEUTSCHLAND GMBH; ATOTECH USA, LLC
Reel/Frame 055653/0714 →