Patent Assignment
Reel/Frame 013991/0550
Assignment of Assignor's Interest
Recorded: 2003-04-22
Pages: 3
Assignor
SHIH, SHOEI-YUAN
Executed: 2003-04-01
Assignee
EVSERV TECH CORPORATION
9F, NO. 196-1, SEC. 3, DATUNG RD.,, SHIJR CITY, TAIPEI HSIEN, R.O.C., TAIWAN
Covered Property
(1)
Improved Signal Connection Assembly of Cooling Module