IP Library › Granted Patent US 6,999,313
Granted Patent B2
US 6,999,313 · App. 10/419,784 · Granted Feb 14, 2006

Signal connection assembly of cooling module

Assignee: Epserv Tech Corporation
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Quick Facts
Patent No.
US 6,999,313
App. No.
10/419,784
Granted
Feb 14, 2006
Kind
B2
Abstract

An improved signal connection assembly of cooling module comprises a housing and a cooling module; a panel on the housing has at least one window and the window has a first connecting structure; the cooling module is coupled the window and has a second connecting structure coupled to the first connecting structure thereon for transmitting the control signal, the power supply, or the power supplied by the power supply to the cooling module.

Claims (15)

1. An improved signal connection structure for cooling module, for discharging the heat produced by each component in a housing, said structure comprising:

a housing, having a panel, and said panel having at least one window, and said window having a carrying section, and said carrying section having a first connecting structure, said first connecting structure comprising a circuit board and a connector;

a cooling module, being coupled to said window and having a carrying board, and said carrying board having a second connecting structure coupled to said first connecting structure; thereby, said cooling module being coupled to said window to connect the first connecting structure with the second connecting structure, so that the control signal and power supply provided by a motherboard and the power supply provided by a power supply being transmitted to said cooling module or transmitting each status of the operation of said cooling module to the motherboard.

2. The improved signal connection structure for cooling module of claim 1 , wherein said circuit board connects to a transmission cable, and said transmission cable connecting to the motherboard or power supply in the housing.

3. The improved signal connection structure for cooling module of claim 1 , wherein said window on the panel has an assembling section.

4. The improved signal connection structure for cooling module of claim 3 , wherein said window on the other side has an insert hole.

5. The improved signal connection structure for cooling module of claim 3 , wherein said window has a protrusion on one side.

6. The improved signal connection structure for cooling module of claim 1 , wherein said carrying board has a fan.

7. The improved signal connection structure for cooling module of claim 1 , wherein said second connecting structure is comprised of a circuit board and a connector.

8. The improved signal connection structure for cooling module of claim 7 , wherein said circuit board is coupled to a transmission cable, and said transmission cable is coupled to a fan.

9. The improved signal connection structure for cooling module of claim 1 , further comprising a fixing structure for securing the carrying board onto the panel.

10. The improved signal connection structure for cooling module of claim 1 , wherein said carrying board has a connecting opening for passing the fixing structure at one end.

11. The improved signal connection structure for cooling module of claim 1 , wherein said carrying board has a protrusion at one end.

12. The improved signal connection structure for cooling module of claim 1 , wherein said carrying section has a circuit board mounted on said carrying section.

13. The improved signal connection structure for heat cooling module of claim 1 , wherein said carrying board has an extension section at one end and a connecting opening is disposed at the connection between said extension section and said carrying board.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2003
From: SHIH, SHOEI-YUAN
To: EVSERV TECH CORPORATION
Reel/Frame 013991/0550 →
Continuity (1)
Related Publication 20040212960A1 · Oct 28, 2004