Patent Assignment
Reel/Frame 013996/0548
Assignment of Assignor's Interest
Recorded: 2002-12-20
Pages: 4
Assignors
MATSUURA, OSAMU
Executed: 2002-11-14
MIURA, KAZUHIRO
Executed: 2002-11-21
YOSHIMURA, HIDEAKI
Executed: 2002-11-19
KISHI, SHINSUKE
Executed: 2002-11-19
Assignee
SONY DISC TECHNOLOGY, INC.
7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Molding Die for Disc Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.