IP Library › Granted Patent US 7,101,171
Granted Patent B2
US 7,101,171 · App. 10/311,853 · Granted Sep 5, 2006

Molding die for disc substrate

Assignee: Sony Disc & Digital Solutions Inc.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,101,171
App. No.
10/311,853
Granted
Sep 5, 2006
Kind
B2
Abstract

A resin ring 51 is press-fitted into a grove portion formed in an inner periphery surface of an interlocking ring 4 . The resin ring 51 is made of a hard resin such as Teflon. The resin ring 51 as a low frictional lubricative member is interposed between the interlock ring 4 and an outer periphery ring 3 . In addition, a cavity 6 as a closed space is formed between a stamper 1 b as a molding surface of a fixed side mirror 1 and a mirror side molding surface 2 b of a moving side mirror 2 . While the moving side mirror 2 is being press-contracted to the fixed side mirror 1 , when a resin material is filled into the cavity 6 , the outer periphery ring 3 is slidably held in a groove of the moving side mirror 2 with predetermined clearances. In the interlock ring 4 , a plurality of openings 4 a which relieve gas produced by the disc resin material filled into the cavity 6 are formed.

Claims (21)

1. A molding die for a disc substrate, the molding die having:

a fixed die member,

a moving die member having a ring-shaped groove formed by a moving side mirror and an interlock ring which is fitted to an outside of the moving side mirror;

an outer periphery ring disposed in opposition to an outer periphery portion of said fixed die member, the fixed die member being in opposition to the moving die member, the outer periphery ring being slidably disposed in an outer periphery portion of the moving die member or the fixed die member,

a stamper being disposed in a cavity formed by the fixed die member, the moving die member, and the outer periphery ring, resin being injected into the cavity and solidified, wherein

a low frictional resin ring with a substantially rectangular cross section is disposed in opposite clearances formed by the outer periphery surface of the outer periphery ring and an inner periphery surface of the interlock ring so that structurally the outer periphery ring is pressed from an outer periphery surface and at the same time can be smoothly slid in the ring-shaped groove, for the reason that, when resin is injected into the cavity, clearances A between the interlock ring and the outer periphery ring can be large and clearances B between an outer periphery surface of the moving side mirror and the outer periphery ring can be kept equal along the entire periphery of the outer periphery ring.

2. The molding die as set forth in claim 1 ,

wherein the resin ring is press-fitted into a groove formed in the inner periphery surface of the interlock ring.

3. The molding die as set forth in claim 1 ,

wherein the resin ring is press-fitted into a groove formed in the outer periphery surface of the outer periphery ring.

4. The molding die as set forth in claim 1 ,

wherein the resin ring is made of polytetrafluoroethylene.

5. The molding die as set forth in claim 1 ,

wherein the low frictional resin ring has a substantially constant elasticity so that force equally presses the outer periphery ring toward the center thereof and deviation of the outer periphery ring from the center position of the cavity caused by the injection pressure is suppressed by the resin member.

6. A molding die for a disc substrate, the molding die having a fixed die member, a moving die member, and an outer periphery ring, the fixed die member being in opposition to the moving die member, the outer periphery ring being slidably disposed in an outer periphery portion of the moving die member or the fixed die member, a stamper being disposed in a cavity formed by the fixed die member, the moving die member, and the outer periphery ring, resin being injected into the cavity and solidified,

wherein a low frictional resin ring with a substantially rectangular cross section and made from polytetrafluoroethylene is disposed in opposite clearances formed by the outer periphery surface of the outer periphery ring and an inner periphery surface of an interlock ring member so that structurally

the outer periphery ring is pressed from an outer periphery and at the same time is smoothly slid in the groove formed by a moving side mirror and the interlock ring member which is fitted to an outside of the moving side mirror, so that when resin is injected into the cavity, clearances A between the interlock ring and the outer periphery ring are large and clearances B between an outer periphery surface of the moving side mirror and the outer periphery ring are kept equal along the entire periphery of the outer periphery ring.

7. The molding die as set forth in claim 6 ,

wherein the resin ring member is press-fitted into a groove formed in the inner periphery surface of the interlock ring member.

8. The molding die as set forth in claim 6 ,

wherein the resin ring is press-fitted into a groove formed in the outer periphery surface of the outer periphery ring.

Assignments (2)
CHANGE OF NAME Recorded Jan 4, 2006
From: SONY DISC TECHNOLOGY INC.
To: SONY DISC & DIGITAL SOLUTIONS INC.
Reel/Frame 017154/0974 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2002
From: MATSUURA, OSAMU; MIURA, KAZUHIRO; YOSHIMURA, HIDEAKI; KISHI, SHINSUKE
To: SONY DISC TECHNOLOGY, INC.
Reel/Frame 013996/0548 →
Priority Claims (2)
JP 2001-129467 · Apr 26, 2001 · national
JP 2001-246144 · Aug 14, 2001 · national
Continuity (1)
Related Publication 20030147990A1 · Aug 7, 2003