Patent Assignment
Reel/Frame 014005/0001
Assignment of Assignor's Interest
Recorded: 2003-04-23
Pages: 4
Assignee
NPTEST, LLC
LEGAL DEPARTMENT, 150 BAYTECH DRIVE, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Method for backside die thinning and polishing of packaged integrated circuits
Application:
10/421,059 →
Publication:
US 2004/0014401
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.