Patent Assignment
Reel/Frame 015242/0574
Assignment of Assignor's Interest
Recorded: 2004-10-13
Received: 2004-10-13
Pages: 36
Assignor
NPTEST, LLC
Executed: 2004-07-13
Assignee
CREDENCE SYSTEMS CORPORATION
1421 CALIFORNIA CIRCLE, MILPITAS, CA, 95035, UNITED STATES
Covered Properties
(25)
Power Supply Device for a Component Testing Installation
Application:
10/466,366 →
Fib Milling of Copper Over Organic Dielectrics
Application:
10/678,438 →
Method for backside die thinning and polishing of packaged integrated circuits
Application:
10/421,059 →
Method for surface preparation to enable uniform etching of polycrystalline materials
Application:
10/420,675 →
Method and Apparatus for Accessing Internal Nodes of an Integrated Circuit Using Ic Package Substrate
Application:
10/382,343 →
Signal paths providing multiple test configurations
Application:
10/371,353 →
Precise, in-Situ Endpoint Detection for Charged Particle Beam Processing
Application:
10/288,896 →
Test System and Methodology
Application:
10/197,134 →
Method for Determining Thickness of a Semiconductor Substrate at the Floor of a Trench
Application:
10/161,272 →
Method and Apparatus for Forming a Cavity in a Semiconductor Substrate Using a Charged Particle Beam
Application:
10/160,606 →
Sub-Resolution Alignment of Images
Application:
10/159,527 →
Open-Loop for Waveform Acquisition
Application:
10/136,710 →
Test System Having Interface Module
Application:
10/132,051 →
Method and Apparatus for Socket Calibration of Integrated Circuit Testers
Application:
10/106,280 →
Test System Algorithmic Program Generators
Application:
10/102,526 →
Test System Formatters Configurable for Multiple Data Rates
Application:
10/101,564 →
Pica System Detector Calibration
Application:
10/079,780 →
Pica System Timing Measurement & Calibration
Application:
10/066,123 →
Comparator Circuit for Differential Swing Comparison and Common-Mode Voltage Comparison
Application:
10/057,134 →
Circuit and Method for Distributing Events in an Event Stream
Application:
10/056,287 →
Outflow System for an Endoscope
Application:
10/041,645 →
Photoconductive-Sampling Voltage Measurement
Application:
10/004,018 →
Method for Global Die Thinning and Polishing of Flip-Chip Packaged Integrated Circuits
Application:
09/924,736 →
Chemically Enhanced Focused Ion Beam Micro-Machining of Copper
Application:
09/871,541 →
Through-The-Substrate Investigation of Flip-Chip Ic's
Application:
09/781,488 →