IP Library › Assignment 014047/0919
Patent Assignment
Reel/Frame 014047/0919

Assignment of Assignor's Interest

Recorded: 2003-10-16 Pages: 3
Assignor
WANG, SUNG-FEI
Executed: 2003-06-09
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, 811, TAIWAN
Covered Property (1)
[High Density Semiconductor Package]
Patent: 6,949,826 →
Application: 10/605,660 →
Publication: US 2004/0104475