IP Library › Assignment 014053/0715
Patent Assignment
Reel/Frame 014053/0715

Assignment of Assignor's Interest

Recorded: 2003-05-12 Pages: 3
Assignors
MCKINNELL, JAMES C.
Executed: 2003-04-24
LIEBESKIND, JOHN
Executed: 2003-04-29
CHEN, CHIEN-HUA
Executed: 2003-04-25
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property (1)
Micro-Fabricated Device with Thermoelectric Device and Method of Making
Patent: 7,205,675 →
Application: 10/353,632 →
Publication: US 2004/0145049
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 26, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026198/0139 →