Patent Assignment
Reel/Frame 014055/0621
Assignment of Assignor's Interest
Recorded: 2003-05-08
Pages: 3
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMOM 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Dividing a Semiconductor Wafer
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.