Patent Assignment
Reel/Frame 014056/0380
Assignment of Assignor's Interest
Recorded: 2003-10-17
Pages: 10
Assignors
CORBELLINI, PARIDE
Executed: 2002-11-08
NEGRI, GIOVANNI
Executed: 2002-11-08
BOVIO, EZIO
Executed: 2002-11-08
MOIRAGHI, LUCA
Executed: 2002-11-11
Assignee
MEMC ELECTRONIC MATERIALS, SPA
VIALE GHERZI 31 28100, NOVARA, ITALY
Covered Property
(1)
Method of Polishing Wafers
Patent:
6,878,302 →
Application:
10/239,669 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 3, 2002
From: CORBELLINI, PARIDE; NEGRI, GIOVANNI; BOVIO, EZIO; MOIRAGHI, LUCA
To: MEMC ELECTRONIC MATERIALS, SPA
Reel/Frame 014248/0264 →
Security Agreement
Apr 1, 2011
From: MEMC ELECTRONIC MATERIALS, INC.; SUNEDISON LLC; SOLAICX
To: BANK OF AMERICA, N.A.
Reel/Frame 026064/0720 →
Release of Security Interest
Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Release of Security Interest
Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Assignment of Assignor's Interest
Jun 7, 2018
From: SUNEDISON SEMICONDUCTOR LIMITED; MEMC JAPAN LIMITED; MEMC ELECTRONIC MATERIALS S.P.A.
To: GLOBALWAFERS CO., LTD.
Reel/Frame 046327/0001 →