IP Library › Assignment 014061/0192
Patent Assignment
Reel/Frame 014061/0192

Assignment of Assignor's Interest

Recorded: 2003-05-08 Pages: 3
Assignors
LEE, JIN-YUAN
Executed: 2003-04-23
CHEN, YING-CHIH
Executed: 2003-04-23
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property (1)
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Patent: 8,021,976 →
Application: 10/434,142 →
Publication: US 2004/0070042
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Assignment of Assignor's Interest Oct 31, 2008
From: LIN, MOU-SHIUNG
To: MEGICA CORPORATION
Reel/Frame 021766/0796 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →