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Patent Assignment
Reel/Frame 021766/0796

Assignment of Assignor's Interest

Recorded: 2008-10-31 Pages: 3
Assignor
LIN, MOU-SHIUNG
Executed: 2008-10-16
Assignee
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD., SCIENCE BASED INDUSTRIAL PARK, HSINCHU, TAIWAN
Covered Property (1)
Method of Wire Bonding Over Active Area of a Semiconductor Circuit
Patent: 8,021,976 →
Application: 10/434,142 →
Publication: US 2004/0070042
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 8, 2003
From: LEE, JIN-YUAN; CHEN, YING-CHIH
To: MEGIC CORPORATION
Reel/Frame 014061/0192 →
Assignment of Assignor's Interest May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →