Patent Assignment
Reel/Frame 014076/0275
Assignment of Assignor's Interest
Recorded: 2003-05-16
Pages: 3
Assignee
DALSA SEMICONDUCTOR INC.
18 AIRPORT BLVD., BROMONT, QUEBEC, J2L 1S7, CANADA
Covered Property
(1)
Wafer Level Packaging Technique for Microdevices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.