Patent Assignment
Reel/Frame 014114/0422
Assignment of Assignor's Interest
Recorded: 2003-05-28
Pages: 4
Assignors
STRANDBERG, JAN I.
Executed: 2003-03-10
TREVINO, RICHARD SCOTT
Executed: 2003-05-07
BLOUNT, THOMAS B.
Executed: 2003-03-12
Assignee
KULICKE & SOFFA INVESTMENTS, INC.
2751 CENTERVILLE ROAD, LITTLE FALLS CENTER II, WILMINGTON, DELAWARE, 19808
Covered Property
(1)
High Density Chip Level Package for the Packaging of Integrated Circuits and Method to Manufacture Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.