Patent Assignment
Reel/Frame 014123/0083
Assignment of Assignor's Interest
Recorded: 2003-05-27
Pages: 2
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Method of manufacturing a semiconductor integrated circuit device
Application:
10/445,403 →
Publication:
US 2003/0224575
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.