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App. No. 10/445,403 · Confirmation No. 1364

Method of manufacturing a semiconductor integrated circuit device

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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 Code Description Pages PDF
2005-04-19 ABN Abandonment 2 View
2005-04-19 EXIN Examiner Interview Summary Record (PTOL - 413) 2 View
2004-08-20 CTNF Non-Final Rejection 13 View
2004-08-20 892 List of references cited by examiner 1 View
2004-08-20 1449 List of References cited by applicant and considered by examiner 1 View
2004-08-20 FWCLM Index of Claims 1 View
2004-08-20 BIB Bibliographic Data Sheet 1 View
2004-08-20 SRFW Search information including classification, databases and other search related notes 1 View
2004-08-20 SRNT Examiner's search strategy and results 3 View
2003-05-27 TRNA Transmittal of New Application 2 View
2003-05-27 A.PE Preliminary Amendment 129 View
2003-05-27 SPEC Specification 52 View
2003-05-27 CLM Claims 20 View
2003-05-27 ABST Abstract 1 View
2003-05-27 DRW Drawings-only black and white line drawings 49 View
2003-05-27 OATH Oath or Declaration filed 3 View
2003-05-27 WFEE Fee Worksheet (SB06) 1 View
2003-05-27 WFEE Fee Worksheet (SB06) 1 View
2003-05-27 FRPR Certified Copy of Foreign Priority Application 99 View
2003-05-27 IDS Information Disclosure Statement (IDS) Form (SB08) 3 View
2003-05-27 FOR Foreign Reference 33 View
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Quick Facts
App. No.
10/445,403
Filed
2003-05-27
Pub. No.
US20030224575A1
Art Unit
2823