Patent Assignment
Reel/Frame 015261/0938
Assignment of Assignor's Interest
Recorded: 2004-04-16
Pages: 5
Assignor
HITACHI, LTD.
Executed: 2004-03-31
Assignee
RENESAS TECHNOLOGY CORP.
4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Properties
(35)
Method for Fabricating Semiconductor Integrated Circuit Device
Patent:
6,239,041 →
Application:
09/380,646 →
Method for Fabricating Semiconductor Integrated Circuit Device
Patent:
6,518,201 →
Application:
09/494,036 →
External Storage Device and Memory Access Control Method Thereof
Method for fabricating semiconductor integrated circuit device
Method for Fabricating Semiconductor Integrated Circuit Device
Method for Fabricating Semiconductor Integrated Circuit Device Using an Oxygen and Hydrogen Catalyst
Method for Fabricating Semiconductor Integrated Circuit Device
Method for Fabricating Semiconductor Integrated Circuit Device
Semiconductor integrated circuit device and a method of manufacturing the same
Application:
10/270,188 →
Publication:
US 2003/0038337
Sram Having an Improved Capacitor
A Semiconductor Device Including an Interconnect Having Copper as a Main Component
Method of Forming a Semiconductor Device with a Capacitor Including a Polycrystalline Tantalum Oxide Film Dielectric
Method for Fabricating Semiconductor Integrated Circuit Device
Method of Manufacturing a Semiconductor Device
Arrangement of Wiring Lines Including Power Source Lines and Channel Wirings of a Semiconductor Integrated Circuit Having Plural Cells
Semiconductor Device with Cmos-Field-Effect Transistors Having Improved Drain Current Characteristics
Semiconductor integrated circuit device
Process for semiconductor apparatus including forming an insulator and a semiconductor film on the backside of the wafer and removing the semiconductor film from the backside
Method of manufacturing a semiconductor integrated circuit device
Application:
10/445,403 →
Publication:
US 2003/0224575
Hardware Accelerator for a Platform-Independent Code
Method of manufacturing a semiconductor device including defect inspection using a semiconductor testing probe
Semiconductor Integrated Circuit Device
Method of Manufacturing a Semiconductor Integrated Circuit Device
Data Processing System and Data Processor
Semiconductor Integrated Circuit Device
Semiconductor Integrated Circuit Device
Semiconductor integrated circuit device
Application:
10/606,954 →
Publication:
US 2004/0012040
Semiconductor Integrated Circuit and Nonvolatile Memory Element
Iii-V Single Crystal as Well as Method of Producing the Same, and Semiconductor Device Utilizing the Iii-V Single Crystal
Semiconductor memory device having faulty cells
Application:
10/629,808 →
Publication:
US 2004/0022249
Semiconductor Integrated Circuit Device Having Deposited Layer for Gate Insulation
Process for Producing Semiconductor Device and Semiconductor Device Produced Thereby
Terminal Apparatus
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Semiconductor Integrated Circuit Device
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 7, 1999
From: TANABE, YOSHIKAZU; SAKAI, SATOSHI; NATSUAKI, NOBUYOSHI
To: HITACHI, LTD.
Reel/Frame 010361/0584 →
Assignment of Assignor's Interest
Mar 14, 2003
From: NOGUCHI, JUNJI; FUJIWARA, TSUYOSHI
To: HITACHI, LTD.
Reel/Frame 013881/0044 →
Assignment of Assignor's Interest
May 8, 2003
From: OHAYASHI, MASAYUKI; YOKOI, TAKASHI
To: HITACHI, LTD.
Reel/Frame 014056/0196 →
Assignment of Assignor's Interest
May 8, 2003
From: OHAYASHI, MASAYUKI; YOKOI, TAKASHI
To: HITACHI, LTD.
Reel/Frame 014056/0194 →
Assignment of Assignor's Interest
Jun 6, 2003
From: KUMAGAI, YUKIHIRO; OHTA, HIROYUKI; OOTSUKA, FUMIO; IKEDA, SHUJI
To: HITACHI, LTD.
Reel/Frame 014749/0962 →
Assignment of Assignor's Interest
Jul 1, 2003
From: NISHIDA, AKIO; YOSHIDA, YASUKO; IKEDA, SHUJI
To: HITACHI, LTD.
Reel/Frame 014224/0862 →
Assignment of Assignor's Interest
Sep 24, 2003
From: OTA, KATSUHIRO; TOMIYAMA, NORIYO; ICHISE, TERUHISA
To: HITACHI, LTD.
Reel/Frame 014538/0533 →
Assignment of Assignor's Interest
Mar 14, 2008
From: RENESAS TECHNOLOGY CORP.
To: SOLID STATE STORAGE SOLUTIONS, LLC
Reel/Frame 020654/0112 →
Merger
Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Merger and Change of Name
Sep 9, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024964/0180 →
Merger
Sep 20, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025008/0362 →
Merger/Change of Name
Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →
Assignment of Assignor's Interest
May 13, 2014
From: RENESAS ELECTRONICS CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 032892/0212 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest
Dec 12, 2016
From: SOLID STATE STORAGE SOLUTIONS, INC.
To: ACACIA RESEARCH GROUP LLC
Reel/Frame 040886/0619 →
Assignment of Assignor's Interest
Dec 22, 2016
From: ACACIA RESEARCH GROUP LLC
To: EMERGENCE MEMORY SOLUTIONS LLC
Reel/Frame 041176/0010 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →