Semiconductor device including an interconnect having copper as a main component
View Patent ↗Provided are a semiconductor device comprising a semiconductor substrate, a first insulating film formed thereover, interconnects formed over the first insulating film and having copper as a main component, a second insulating film formed over the upper surface and side surfaces of each of the interconnects and over the first insulating film and having a function of suppressing or preventing copper diffusion, and a third insulating film formed over the second insulating film and having a dielectric constant lower than that of the second insulating film; and a method of manufacturing the semiconductor device. This invention makes it possible to improve dielectric breakdown strength between copper interconnects and reduce capacitance between the copper interconnects.
1. A semiconductor device, comprising:
a semiconductor substrate;
a first insulating film formed thereover;
interconnects formed over the first insulating film and having copper as a main component;
a second insulating film formed over an upper surface and side surfaces of each of the interconnects and over the first insulating film, and having a function of suppressing or preventing copper diffusion; and
a third insulating film formed over the second insulating film and having a dielectric constant lower than that of the second insulating film,
wherein the second insulating film includes a first portion formed beside upper portions of the interconnects and a second portion formed over the first insulating film, and
wherein a thickness of the first portion is thicker than a thickness of the second portion.
2. A semiconductor device according to claim 1 , wherein a void is formed between two adjacent interconnects of the interconnects.
3. A semiconductor device according to claim 2 , wherein the void is formed between most proximate interconnects of the interconnects.
4. A semiconductor device according to claim 1 , wherein a void surrounded by the second insulating film and the third insulating film is formed between two adjacent interconnects of the interconnects.
5. A semiconductor device according to claim 1 , wherein a void is formed in the second insulating film filling a space between two adjacent interconnects of the interconnects.
6. A semiconductor device comprising a plurality of interconnect layers formed over a semiconductor substrate,
at least one of the plurality of interconnect layers including:
a first interconnect formed over a first insulating film and having copper as a main component;
a second insulating film formed over an upper surface and side surfaces of the first interconnect and over the first insulating film, and having a function of suppressing or preventing copper diffusion; and
a third insulating film formed over the second insulating film and having a dielectric constant lower than that of the second insulating film,
wherein a void is formed between two adjacent interconnects of the first interconnects, and
wherein the second insulating film includes a first portion formed beside an upper portion of the first interconnect and a second portion formed over the first insulating film, and
wherein a thickness of the first portion is thicker than a thickness of the second portion.
7. A semiconductor device according to claim 6 , wherein at least one interconnect layer, among the plurality of interconnect layers, includes:
a fourth insulating film having opening portions;
second interconnects formed to embed the opening portions and having copper as a main component;
a fifth insulating film formed over the fourth insulating film and the interconnects, and having a function of suppressing or preventing copper diffusion; and
a sixth insulating film formed over the fifth insulating film and having a dielectric constant lower than that of the fifth insulating film.
8. A semiconductor device, comprising:
a semiconductor substrate;
a first insulating film formed thereover;
interconnects formed over the first insulating film and having copper as a main component;
a conductor portion disposed over the first insulating film to be contiguous to the interconnects;
a second insulating film formed over an upper surface and side surfaces of each of the interconnects, an upper surface and side surfaces of the conductor portion, and over the first insulating film, and having a function of suppressing or preventing copper diffusion; and
a third insulating film formed over the second insulating film and having a dielectric constant lower than that of the second insulating film,
wherein a void is formed between the interconnects and the conductor portion,
wherein the second insulating film includes a first portion formed beside an upper portion of the interconnects, a second portion formed beside an upper portion of the conductor portion, and a third portion formed over the first insulating film and
wherein a thickness of the first portion and a thickness of the second portion are thicker than a thickness of the third portion.
9. A semiconductor device according to claim 8 , wherein the conductor portion is formed of the same material as the interconnects and is a conductor pattern which does not function as an interconnect of the semiconductor device.