Patent Assignment
Reel/Frame 014538/0533
Assignment of Assignor's Interest
Recorded: 2003-09-24
Pages: 2
Assignors
OTA, KATSUHIRO
Executed: 2003-06-03
TOMIYAMA, NORIYO
Executed: 2003-06-06
ICHISE, TERUHISA
Executed: 2003-06-09
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Process for semiconductor apparatus including forming an insulator and a semiconductor film on the backside of the wafer and removing the semiconductor film from the backside
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 16, 2004
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015261/0938 →
Merger
Sep 20, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025008/0362 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →