IP Library Assignment 026837/0505
Patent Assignment
Reel/Frame 026837/0505

Merger/Change of Name

Recorded: 2011-08-31 Received: 2011-08-31 Pages: 16
Assignor
RENESAS TECHNOLOGY CORP.
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JPX, JAPAN
Covered Properties (100)
Integrated Circuit and Information Processing Device
Application: 12/813,966 →
Semiconductor Memory Having Electrically Erasable and Programmable Semiconductor Memory Cells
Application: 12/504,307 →
Display Apparatus and Driving Device for Displaying
Application: 12/411,984 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Application: 12/320,679 →
Semiconductor Integrated Circuit Device
Application: 12/348,524 →
Processor System Using Synchronous Dynamic Memory
Application: 12/123,195 →
Terminal Apparatus
Application: 12/112,968 →
Memory Card
Application: 12/015,050 →
Semiconductor Integrated Circuit Device
Application: 11/970,370 →
Semiconductor Memory Having Electrically Erasable and Programmable Semiconductor Memory Cells
Application: 11/870,196 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Application: 11/860,762 →
Picture Processing Engine and Picture Processing System
Application: 11/688,894 →
Semiconductor Integrated Circuit Device, Production and Operation Method Thereof
Application: 11/700,085 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Application: 11/657,473 →
Optical Disk Drive Control Circuit
Application: 11/641,763 →
Memory Card
Application: 11/636,629 →
Processor System Using Synchronous Dynamic Memory
Application: 11/598,661 →
Semiconductor Integrated Circuit Device
Application: 11/526,612 →
Phase Change Memory and Phase Change Recording Medium
Application: 11/514,272 →
Semiconductor Device Having Capacitive Insulation Means and Communication Terminal Using the Device
Application: 11/495,585 →
Method of Manufacturing Semiconductor Device Having Conductive Thin Films
Application: 11/480,912 →
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Application: 11/362,732 →
Multi-Chip Module
Application: 11/350,919 →
Semiconductor Device
Application: 11/348,351 →
Pb-Free Solder-Connected Structure and Electronic Device
Application: 11/331,220 →
Semiconductor Apparatus and Manufacturing Method
Application: 11/324,315 →
Power Supply Driver Circuit
Application: 11/287,293 →
Broadcast Station Synchronization Method and Mobile Terminal
Application: 11/260,083 →
Process for Treating Solid Surface and Substrate Surface
Application: 11/252,786 →
Display Apparatus and Driving Device for Displaying
Application: 11/248,308 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Application: 11/245,338 →
Semiconductor Memory Having Electrically Erasable and Programmable Semiconductor Memory Cells
Application: 11/206,995 →
Display Apparatus and Driving Device for Displaying
Application: 11/126,160 →
Semiconductor Integrated Circuit Device
Application: 11/124,060 →
Semiconductor Device and Its Manufacturing Method
Application: 10/503,972 →
Semiconductor Device and Process for Producing the Same
Application: 11/108,827 →
Semiconductor Device
Application: 11/108,735 →
Electrically Alterable Non-Volatile Multi-Level Memory Device and Method of Operating Such a Device
Application: 11/043,114 →
Semiconductor Integrated Circuit Device
Application: 11/042,172 →
A Semiconductor Device Including Primary and Secondary Side Circuits on First and Second Substrates with Capacitive Insulation
Application: 11/024,680 →
Semiconductor Device
Application: 10/909,402 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Application: 10/898,333 →
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Application: 10/890,321 →
Semiconductor Integrated Circuit Device in Which Operating Frequency, Supply Voltage and Substrate Bias Voltage Are Controllable to Reduce Power Consumption
Application: 10/888,983 →
Semiconductor Memory Having Electrically Erasable and Programmable Semiconductor Memory Cells
Application: 10/872,515 →
Memory Card
Application: 10/476,223 →
Wiring Tape for Semiconductor Device Including a Buffer Layer Having Interconnected Foams
Application: 10/830,051 →
Semiconductor Device and Method for Producing the Same
Application: 10/825,436 →
Processor System Using Synchronous Dynamic Memory
Application: 10/752,569 →
Semiconductor Device and Testing Method of Semiconductor Device
Application: 10/714,943 →
Semiconductor Memory Apparatus, Semiconductor Apparatus, Data Processing Apparatus and Computer System
Application: 10/686,569 →
Semiconductor Memory Having Electrically Erasable and Programmable Semiconductor Memory Cells
Application: 10/685,441 →
Nonvolatile Semiconductor Memory Device with Improved Gate Oxide Film Arrangement
Application: 10/684,379 →
Probe Sheet, Probe Card, Semiconductor Test Equipment and Semiconductor Device Fabrication Method
Application: 10/676,609 →
Phase-Locked Loop Circuit and Radio Communication Apparatus Using the Same
Application: 10/641,136 →
Terminal Apparatus
Application: 10/639,445 →
Semiconductor Device with Cmos-Field-Effect Transistors Having Improved Drain Current Characteristics
Application: 10/433,786 →
Method of Manufacturing a Dual Gate Semiconductor Device with a Poly-Metal Electrode
Application: 10/448,351 →
Semiconductor Device, and the Method of Testing or Making of the Semiconductor Device
Application: 10/413,135 →
Semiconductor Device Having a Capacitor and a Metal Interconnect Layer with Tungsten as a Main Constituent Material and Containing Molybdenum
Application: 10/395,248 →
Semiconductor Device and Process for Producing the Same
Application: 10/392,916 →
Method for Manufacturing Semiconductor Device and Electronic Device and Method for Calculating Connection Condition
Application: 10/372,392 →
Semiconductor Device Provided with Rewiring Layer
Application: 09/787,526 →
A Semiconductor Device Including Active Regions and Gate Electrodes for Field Effect Transistors, with a Trench Formed Between the Active Regions
Application: 10/330,196 →
Method of Manufacturing Semiconductor Apparatus
Application: 10/326,663 →
Semiconductor Memory Apparatus, Semiconductor Apparatus, Data Processing Apparatus and Computer System
Application: 10/320,516 →
Semiconductor-Device Inspecting Apparatus and a Method for Manufacturing the Same
Application: 10/316,828 →
Semiconductor Memory Having Electrically Erasable and Programmable Semiconductor Memory Cells a Semiconductor Memory Having Elelctrically Programmable Semiconductor Memory Cells
Application: 10/304,046 →
Semiconductor Device and Manufacturing Method
Application: 10/301,624 →
Power Amplifier Module
Application: 10/239,157 →
Semiconductor Integrated Circuit Device and Method of Manufacturing the Same
Application: 10/295,908 →
Radiation-Sensitive Composition and Method for Forming Patterns and Fabricating Semiconductor Devices
Application: 10/294,618 →
Data Processing Apparatus Having Dram Incorporated Therein
Application: 10/284,153 →
Semiconductor Integrated Circuit Device and Contactless Electronic Device
Application: 10/282,142 →
Method of Manufacturing a Dual Gate Semiconductor Device with a Poly-Metal Electrode
Application: 10/272,369 →
Method of Producing Electronic Part with Bumps and Method of Producing Electronic Part
Application: 10/267,869 →
Semiconductor Device Having Solder Bumps Reliably Reflow Solderable
Application: 10/265,660 →
Method and Apparatus for Picking Up 2D Image of an Object to Be Sensed
Application: 10/265,659 →
Method of Manufacturing Semiconductor Device Having Conductive Thin Films
Application: 10/265,105 →
Semiconductor Device and Contactor for Inspection
Application: 10/260,348 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Application: 10/252,438 →
Semiconductor Device with Improved Arrangements to Avoid Breadkage of Tungsten Interconnector
Application: 10/252,534 →
Semiconductor Device
Application: 10/212,104 →
Semiconductor Integrated Circuit Device, Production and Operation Method Thereof
Application: 10/206,982 →
Pb-Free Solder-Connected Structure and Electronic Device
Application: 10/187,897 →
Logic Circuit Including Combined Pass Transistor and Cmos Circuits and a Method of Synthesizing the Logic Circuit
Application: 10/178,216 →
Display Apparatus and Driving Device for Displaying
Application: 10/161,635 →
A Microcomputer Including A Flash Memory That is Two-Way Programmable
Application: 10/158,901 →
Semiconductor Integrated Circuit Device
Application: 10/154,956 →
Method of Forming Bumps
Application: 10/155,730 →
Process for Producing Semiconductor and Apparatus for Production
Application: 10/150,950 →
Semiconductor Device and Lead Frame Therefor
Application: 10/136,409 →
Semiconductor Integrated Circuit Device Including a Cache Having a Comparator and a Memory
Application: 10/095,030 →
Semiconductor Integrated Circuit Device
Application: 10/052,251 →
Apparatus Has a Microprocessor Including Dsp and a Cpu Integrated with Each Other as a Single Bus Master
Application: 10/028,425 →
Semiconductor Memory Device Having a Double Data Rate (Ddr) Mode and Utilizing a Plurality of Comparison Circuits to Prevent Errors Due to a Late Write Function
Application: 10/005,361 →
Phase-Locked Loop Circuit and Radio Communication Apparatus Using the Same
Application: 09/993,764 →
Multi-Chip Module
Application: 09/988,415 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Application: 09/987,957 →
Data Line Disturbance Free Memory Block Divided Flash Memory and Microcomputer Having Flash Memory Therein
Application: 09/987,958 →