IP Library Granted Patent US 7,114,110
Granted Patent B2
US 7,114,110 · App. 10/413,135 · Granted Sep 26, 2006

Semiconductor device, and the method of testing or making of the semiconductor device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,114,110
App. No.
10/413,135
Granted
Sep 26, 2006
Kind
B2
Abstract

A signature circuit, i.e., a random-number generating circuit, is provided in a memory test apparatus. Also, a signature circuit is provided in each of devices-under-test. This configuration allows the large number of semiconductor integrated-circuit devices to be tested at one time with a high efficiency. This condition realizes a tremendous reduction in the test cost.

Claims (19)

1. A semiconductor testing apparatus, comprising:

a pattern generating circuit for generating a test waveform for testing a semiconductor integrated-circuit device, and generating pattern data including information on said test waveform,

a judgement-data generating circuit for generating judgement data from said pattern data, and

a comparator circuit for making a comparison between judgement response data and said judgement data, and judging whether or not said judgement response data and said judgement data match with each other, said judgement response data being outputted from said semiconductor integrated-circuit device, said judgement data being generated by said judgement-data generating circuit,

wherein said judgement-data generating circuit includes a random-number generating circuit for generating a random number from said pattern data.

2. The semiconductor testing apparatus as claimed in claim 1 , wherein said judgement-data generating circuit includes a cumulating circuit for cumulating said pattern data.

3. A semiconductor integrated-circuit device testing method, comprising the steps of:

connecting two or more semiconductor integrated-circuit devices to one interface circuit,

inputting test waveforms into internal circuits of said two or more semiconductor integrated-circuit devices via said one interface circuit, respectively,

generating judgement response data in said respective semiconductor integrated-circuit devices, said judgement response data each produced from response waveforms generated by said internal circuits, and

making a comparison between said judgement response data and judgement data on said each semiconductor integrated-circuit device basis, said judgement response data being produced by said respective semiconductor integrated-circuit devices, said judgement data being set up in advance,

wherein said judgement response data is a random number generated from said response waveforms generated by said internal circuits.

4. The semiconductor integrated-circuit device testing method as claimed in claim 3 , wherein said judgement response data is data that results from cumulating said response waveforms generated by said internal circuits.

5. A semiconductor integrated-circuit device testing method, comprising the steps of:

connecting two or more semiconductor integrated-circuit devices to one interface circuit,

inputting test waveforms into internal circuits of said two or more semiconductor integrated-circuit devices via said one interface circuit,

generating judgement response data in said respective semiconductor integrated-circuit devices, said judgement response data each produced from response waveforms generated by said internal circuits, and

making a comparison between judgement data and said judgement response data on said each semiconductor integrated-circuit device basis, said judgement response data being produced by said respective semiconductor integrated-circuit devices, said judgement data generated from an expectation data pattern.

wherein said judgement response data is a random number generated from said response waveforms generated by said internal circuits.

Assignments (3)
MERGER/CHANGE OF NAME Recorded Aug 31, 2011
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 026837/0505 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014569/0585 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2003
From: KIKUCHI, SHUJI; TOBA, TADANOBU; HIRANO, KATSUNORI; SONODA, YUJI; WADA, TAKESHI
To: HITACHI, LTD.
Reel/Frame 014238/0542 →