IP Library Assignment 014142/0126
Patent Assignment
Reel/Frame 014142/0126

Assignment of Assignor's Interest

Recorded: 2003-05-29 Pages: 2
Assignor
ALTER, MARTIN
Executed: 2003-05-29
Assignee
MICREL, INCORPORATED
1849 FORTUNE DRIVE, SAN JOSE, CALIFORNIA, 95131
Covered Property (1)
Integrating Chip Scale Packaging Metallization into Integrated Circuit Die Structures
Patent: 6,917,105 →
Application: 10/453,157 →
Publication: US 2004/0245631
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 16, 2019
From: MICREL LLC
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 051291/0211 →
Merger Dec 16, 2019
From: MICREL, INCORPORATED
To: MICREL LLC
Reel/Frame 051295/0334 →
Corrective Assignment to Correct the Correct Patent Number 6876244 Previously Recorded at Reel: 051295 Frame: 0334. Assignor(S) Hereby Confirms the Assignment. Dec 18, 2019
From: MICREL, INCORPORATED
To: MICREL LLC
Reel/Frame 051345/0367 →
Release of Security Interest Dec 21, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 051398/0809 →
Release of Security Interest Dec 21, 2019
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; ATMEL CORPORATION
Reel/Frame 051398/0827 →
Assignment of Assignor's Interest Mar 9, 2024
From: SONRAI MEMORY LIMITED
To: NERA INNOVATIONS LIMITED
Reel/Frame 066778/0178 →