Patent Assignment
Reel/Frame 014170/0573
Assignment of Assignor's Interest
Recorded: 2003-12-03
Pages: 3
Assignors
BROUILLETTE, GUY
Executed: 2003-12-01
DANOVITCH, DAVID
Executed: 2003-12-01
HENRY, JEAN-PAUL
Executed: 2003-12-01
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD RD., ARMONK, NEW YORK, 10504
Covered Property
(1)
Method and Apparatus for Transferring Solder Bumps
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 14, 2010
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023778/0195 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →