Patent Assignment
Reel/Frame 023778/0195
Assignment of Assignor's Interest
Recorded: 2010-01-14
Pages: 5
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2009-12-30
Assignee
TESSERA INTELLECTUAL PROPERTIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(24)
Lead-Free, Tin-Based Multi-Component Solder Alloys
Patent:
5,730,932 →
Application:
08/612,614 →
Socket for Semi-Permanently Connecting a Solder Ball Grid Array Device Using a Dendrite Interposer
Patent:
5,770,891 →
Application:
08/718,120 →
Wire Bonding to Dual Metal Covered Pad Surfaces
Patent:
6,759,597 →
Application:
09/017,338 →
Hybrid Molds for Molten Solder Screening Process
Patent:
6,390,439 →
Application:
09/287,370 →
Method of Reforming Reformable Members of an Electronic Package and the Resultant Electronic Package
Method for Direct Chip Attach by Solder Bumps and an Underfill Layer
Patent:
6,341,418 →
Application:
09/301,890 →
Partially Captured Oriented Interconnections for Bga Packages and a Method of Forming the Interconnections
Patent:
6,774,474 →
Application:
09/438,037 →
Wire Bonding to Dual Metal Covered Pad Surfaces
Patent:
6,519,845 →
Application:
09/481,478 →
Circuit board component retention
Patent:
6,347,732 →
Application:
09/538,460 →
Temporary Attach Article and Method for Temporary Attach of Devices to a Substrate
Structure and Method for Wiring Translation Between Grids with Non-Integral Pitch Ratios in Chip Carrier Modules
Low Temperature Solder Chip Attach Structure
Method of Attaching a Conformal Chip Carrier to a Flip Chip
Method for Direct Chip Attach by Solder Bumps and an Underfill Layer
Method of Reforming Reformable Members of an Electronic Package and the Resultant Electronic Package
Ball Grid Array Module
I/C Chip Suitable for Wire Bonding
Method and Apparatus for Transferring Solder Bumps
Method for Forming Robust Solder Interconnect Structures by Reducing Effects of Seed Layer Underetching
Low Temperature Solder Chip Attach Structure and Process to Produce a High Temperature Interconnection
Method for Forming Robust Solder Interconnect Structures by Reducing Effects of Seed Layer Underetching
Method of Reforming Reformable Members of an Electronic Package and the Resultant Electronic Package
Method of Forming a Bond Pad on an I/C Chip and Resulting Structure
Forming Robust Solder Interconnect Structures by Reducing Effects of Seed Layer Underetching
Related Assignments
(15)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 6, 1996
From: SARKHEL, AMIT K.; WOYCHIK, CHARLES GERHARD
To: INTERNATIONAL BUSINESS MACHINES CORPORATION, A CORP. OF NEW YORK
Reel/Frame 007899/0655 →
Assignment of Assignor's Interest
Feb 2, 1998
From: CUTTING, LAWRENCE R.; GAUDIELLO, JOHN G.; MATIENZO, LUIS J.; MURDESHWAR, NIKHIL M.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 008950/0284 →
Assignment of Assignor's Interest
Apr 7, 1999
From: CORDES, STEVEN A.; DANOVITCH, DAVID HIRSCH; GRUBER, PETER ALFRED; SPEIDELL, JAMES LOUIS
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 009885/0735 →
Assignment of Assignor's Interest
Apr 27, 1999
From: ALCOE, DAVID J.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 009926/0217 →
Assignment of Assignor's Interest
Apr 29, 1999
From: BROUILLETTE, GUY P.; DANOVITCH, DAVID H.; GRUBER, PETER A.; LIEHR, MICHAEL
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 010150/0363 →
Assignment of Assignor's Interest
Nov 10, 1999
From: CALETKA, DAVID V.; JOHNSON, ERIC A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 010386/0726 →
Assignment of Assignor's Interest
Nov 20, 2001
From: DAVES, GLENN G.; FRANKEL, JASON; SHUTLER, WILLIAM F.; SIGLER, ANTHONY W.
To: IBM CORPORATION
Reel/Frame 012319/0620 →
Assignment of Assignor's Interest
Mar 28, 2003
From: ALCOE, DAVID J.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 013927/0269 →
Assignment of Assignor's Interest
Sep 18, 2003
From: BIGGS, JULIE C.; CHENG TIEN-JEN; EICHSTADT, DAVID E.; FANTI, LISA A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 014536/0979 →
Assignment of Assignor's Interest
Dec 3, 2003
From: BROUILLETTE, GUY; DANOVITCH, DAVID; HENRY, JEAN-PAUL
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 014170/0573 →
Assignment of Assignor's Interest
Mar 17, 2004
From: SRIVASTAVA, KAMALESH K.; SHINDE, SUBHASH L.; CHENG, TIEN-JEN; KNICKERBOCKER, SARAH H.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 014423/0834 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →