Method of reforming reformable members of an electronic package and the resultant electronic package
View Patent ↗An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member.
1. A method of making an electronic package comprising:
providing a substrate having a contact pad thereon;
positioning a reformable member on said contact pad;
positioning an elastic member substantially around said reformable member, said elastic member exerting a girdling force on said reformable member; and
softening said reformable member such that said elastic member elongates said reformable member.
2. The method of claim 1 wherein the step of positioning said reformable member is accomplished by surface tension.
3. The method of claim 2 wherein the step of positioning said elastic member substantially around said reformable member further includes the steps of positioning said elastic member around a pin on an alignment fixture, aligning said elastic member with said reformable member, and transferring said elastic member onto said reformable member.
4. The method of claim 1 further comprising the steps of providing another contact pad adjacent said first contact pad on said substrate, positioning another reformable member on said other contact pad, positioning another elastic member substantially around said other reformable member, said other elastic member exerting a girdling force on said other reformable member, and softening said other reformable member such that said other elastic member elongates said other reformable member.
5. The method of claim 4 further comprising the step of using a connector to position said elastic members substantially around said reformable members.
6. The method of claim 1 wherein said step of positioning said elastic member substantially around said reformable member includes the step of prestressing said elastic member.
7. The method of claim 1 wherein the step of positioning said elastic member is performed while said reformable member is in a solid state.
8. A method of making an electronic package comprising:
providing a substrate having a contact pad thereon;
positioning a reformable member by surface tension on said contact pad;
positioning an elastic member substantially around said reformable member, said elastic member exerting a girdling force on said reformable member, said elastic member positioned substantially around said reformable member by positioning said elastic member around a pin on an alignment fixture, aligning said elastic member with said reformable member, and transferring said elastic member onto said reformable member;
softening said reformable member such that said elastic member elongates said reformable member; and
removing said pin of said alignment fixture from said reformable member.
9. A method of making an electronic package comprising:
providing a substrate having contact pads thereon;
positioning a reformable member on each of said contact pads;
positioning an elastic member using a connector substantially around each of said reformable members, said elastic member exerting a girdling force on each of said reformable members; and
detaching and removing said connector from each of said elastic members.
10. A method of making an electronic package comprising:
providing a substrate having a contact pad thereon;
providing a reformable member;
positioning an elastic member substantially around said reformable members, said elastic member exerting a girdling force on said reformable members;
positioning a reformable member on said contact pad; and
softening said reformable member such that said elastic member elongates said reformable member.