IP Library › Granted Patent US 6,566,612
Granted Patent Utility
US 6,566,612 · Confirmation No. 8948

METHOD FOR DIRECT CHIP ATTACH BY SOLDER BUMPS AND AN UNDERFILL LAYER

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2020-06-11 OATH Oath or Declaration filed 262 View
2011-02-15 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-02-15 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-02-04 PA.. Power of Attorney 1 View
2011-02-04 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2011-02-04 N417 Electronic Filing System Acknowledgment Receipt 2 View
2002-01-22 TRNA Transmittal of New Application 8 View
2002-01-22 SPEC Specification 27 View
2002-01-22 CLM Claims 8 View
2002-01-22 ABST Abstract 1 View
2002-01-22 DRW Drawings-only black and white line drawings 3 View
2002-01-22 OATH Oath or Declaration filed 11 View
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Quick Facts
Patent No.
US 6,566,612
App. No.
10/055,294
Filed
2002-01-22
Granted
2003-05-20
Pub. No.
US20020062556A1
Art Unit
2827
PTA
-7 days