IP Library › Assignment 010150/0363
Patent Assignment
Reel/Frame 010150/0363

Assignment of Assignor's Interest

Recorded: 1999-04-29 Pages: 5
Assignors
BROUILLETTE, GUY P.
Executed: 1999-03-24
DANOVITCH, DAVID H.
Executed: 1999-03-24
GRUBER, PETER A.
Executed: 1999-03-31
LIEHR, MICHAEL
Executed: 1999-04-15
SAMBUCETTI, CARLOS J.
Executed: 1999-04-05
Assignee
Covered Property (1)
Method for Direct Chip Attach by Solder Bumps and an Underfill Layer
Patent: 6,341,418 →
Application: 09/301,890 →
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 14, 2010
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 023778/0195 →
Change of Name Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →