Patent Assignment
Reel/Frame 014189/0781
Assignment of Assignor's Interest
Recorded: 2003-12-11
Pages: 3
Assignor
HANAOKA, TERUNAO
Executed: 2003-11-17
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Wiring Board Having Interconnect Pattern with Land, and Semiconductor Device, Circuit Board, and Electronic Equipment Incorporating the Same