Patent Assignment
Reel/Frame 014194/0142
Assignment of Assignor's Interest
Recorded: 2003-06-13
Pages: 3
Assignee
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
11 SCIENCE PARK ROAD, #01-01/03 THE ALPH, SINGAPORE SCIENCE PARK II, 117684, SINGAPORE
Covered Property
(1)
Method to fabricate a highly perforated silicon diaphragm with controlable thickness and low stress
Application:
10/462,310 →
Publication:
US 2004/0253760
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.