Patent Assignment
Reel/Frame 014890/0200
Assignment of Assignor's Interest
Recorded: 2004-01-20
Pages: 3
Assignor
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Executed: 2003-11-03
Assignee
KNOWLES ELECTRONICS, LLC
1151 MAPLEWOODDRIVE, ITASCA, ILLINOIS, 60143
Covered Property
(1)
Method to fabricate a highly perforated silicon diaphragm with controlable thickness and low stress
Application:
10/462,310 →
Publication:
US 2004/0253760
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.