IP Library Patent Application 10462310
Patent Application Utility
App. No. 10/462,310 · Confirmation No. 6379

Method to fabricate a highly perforated silicon diaphragm with controlable thickness and low stress

Inventors: Qingxin Zhang, Zhe Wang
Abandoned -- Failure to Respond to an Office Action View Publication ↗
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2005-01-14 ABN Abandonment 2 View
2004-03-18 CTNF Non-Final Rejection 5 View
2004-03-18 892 List of references cited by examiner 1 View
2004-03-18 1449 List of References cited by applicant and considered by examiner 6 View
2004-03-18 SRFW Search information including classification, databases and other search related notes 1 View
2004-03-14 SRNT Examiner's search strategy and results 1 View
2004-03-01 CTMS Miscellaneous Action with shortened statutory period (SSP) 2 View
2004-01-29 PA.. Power of Attorney 5 View
2004-01-29 C.AD Change of Address 1 View
2003-09-04 FOR Foreign Reference 16 View
2003-09-04 FOR Foreign Reference 40 View
2003-09-04 FOR Foreign Reference 28 View
2003-09-04 FOR Foreign Reference 30 View
2003-09-04 PA.. Power of Attorney 1 View
2003-09-04 IDS Information Disclosure Statement (IDS) Form (SB08) 11 View
2003-06-13 TRNA Transmittal of New Application 1 View
2003-06-13 SPEC Specification 11 View
2003-06-13 CLM Claims 7 View
2003-06-13 ABST Abstract 1 View
2003-06-13 DRW Drawings-only black and white line drawings 4 View
2003-06-13 OATH Oath or Declaration filed 2 View
2003-06-13 WCLM Claims Worksheet (PTO-2022) 1 View
2003-06-13 WFEE Fee Worksheet (SB06) 1 View
2003-06-13 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/462,310
Filed
2003-06-13
Pub. No.
US20040253760A1
Art Unit
2812