IP Library Assignment 014208/0943
Patent Assignment
Reel/Frame 014208/0943

Assignment of Assignor's Interest

Recorded: 2003-12-22 Pages: 3
Assignors
WU, MU-JUNG
Executed: 2003-12-02
CHUNG, MING-YEN
Executed: 2003-12-02
Assignee
POWERCHIP SEMICONDUCTOR CORP.
NO. 12, LI-HSIN RD. I, SCIENCE-BASED INDUSTRIAL, PARK, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Wafer Grinding Apparatus
Patent: 6,910,956 →
Application: 10/707,561 →
Publication: US 2005/0136809
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jun 24, 2019
From: POWERCHIP SEMICONDUCTOR CORP.
To: POWERCHIP TECHNOLOGY CORPORATION
Reel/Frame 049562/0151 →
Assignment of Assignor's Interest Jul 12, 2019
From: POWERCHIP TECHNOLOGY CORPORATION
To: POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION
Reel/Frame 049732/0132 →