Patent Assignment
Reel/Frame 014216/0571
Assignment of Assignor's Interest
Recorded: 2003-12-24
Pages: 3
Assignors
CHEN, YU-WEN
Executed: 2003-07-14
HO, MING-LUN
Executed: 2003-07-14
LEE, SHIH-CHANG
Executed: 2003-07-14
CHANG, CHIH-HUANG
Executed: 2003-07-14
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING , INC.
26, CHIN 3RD. RD., NANTZE EXPORT PROCESSING ZONE,, KAOHSIUNG, TAIWAN
Covered Property
(1)
[Flip Chip Package Structure]