IP Library › Assignment 014216/0830
Patent Assignment
Reel/Frame 014216/0830

Assignment of Assignor's Interest

Recorded: 2003-06-27 Pages: 2
Assignors
KUB, FRANCIS
Executed: 2003-05-07
HOBART, KARL
Executed: 2003-05-20
Assignee
NAVY, UNITED STATES OF AMERICA, THE, AS REPRESENTED BY THE SECRETARY
800 NORTH QUINCY STREET, BALLSTON TOWER ONE, (ATTN: CODE OOCCIP), CHIEF OF NAVAL RESEARCH, OFFICE OF COUNSEL, ARLINGTON, VIRGINIA, 22217
Covered Property (1)
Wafer Bonding of Thinned Electronic Materials and Circuits to High Performance Substrates
Patent: 7,535,100 →
Application: 10/457,692 →
Publication: US 2004/0009649