Patent Assignment
Reel/Frame 014228/0740
See Recording at Reel 015087 Frame 0786. (Document
Recorded: 2003-06-24
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Trench Isolated Integrated Circuit Devices Including Grooves
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.