Patent Assignment
Reel/Frame 015087/0786
Assignment of Assignor's Interest
Recorded: 2003-06-23
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO. LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Methods of Forming Trench Isolated Integrated Circuit Devices Including Grooves
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.