Patent Assignment
Reel/Frame 014249/0553
Corrective to Correct the Second Assignee's Address Previously Recorded at Reel 013759 Frame 0710. (Assignment of Assignor's Interest)
Recorded: 2003-07-08
Pages: 3
Assignors
KANETANI, KAZUO
Executed: 2001-12-03
NAMBU, HIROAKI
Executed: 2001-12-03
YAMASAKI, KANAME
Executed: 2001-12-06
ARAKAWA, FUMIHIKO
Executed: 2001-12-04
KUSUNOKI, TAKESHI
Executed: 2001-12-04
HIGETA, KEIICHI
Executed: 2001-12-04
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI DEVICE ENGINEERING CO., LTD
3682, HAYANO, MOBARA-SHI, CHIBA-KEN, 297-8581, JAPAN
Covered Property
(1)
Method of Testing a Semiconductor Integrated Device
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 1, 2003
From: HITACHI, LTD
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014545/0033 →
Merger
Jul 7, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024662/0280 →
Assignment of Assignor's Interest
Sep 23, 2015
From: HITACHI DEVICE ENGINEERING CO., LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 036667/0622 →
Merger and Change of Name
Sep 23, 2015
From: RENESAS TECHNOLOGY CORP.; NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 036667/0733 →