Patent Assignment
Reel/Frame 014249/0601
Assignment of Assignor's Interest
Recorded: 2004-01-09
Pages: 4
Assignors
SIRINORAKUL, SARAVUTH
Executed: 2003-11-27
NONDHASITTHICHAI, SOMCHAI
Executed: 2003-11-27
JEWJAITHAM, SITTA
Executed: 2003-11-27
CHUA, YEE HEONG
Executed: 2003-11-27
Assignee
NS ELECTRONICS OF BANGKOK (1993) LTD.
40/10 SUKHUMVIT 105 (LASALLE), BANGNA BANGKOK 10260, THAILAND
Covered Property
(1)
Method of Fabricating No-Lead Package for Semiconductor Die with Half-Etched Leadframe
Patent:
7,153,724 →
Application:
10/637,965 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Feb 25, 2008
From: NS ELECTRONICS BANGKOK (1993) LTD.
To: UTAC THAI LIMITED
Reel/Frame 020550/0925 →
Assignment of Assignor's Interest
Mar 1, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0937 →
Corrective Assignment to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0937. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039902/0302 →